An AIO flight controller board with an integrated PDB, BFOSD and a 3A 5V BEC. Now in fiery race red; HGLRC F4 Flame V2 builds on the highly popular HGLRC F4 Flame V1, improving on the convenient straightforward connection layout of the initial Flame; making for an easy build even for beginners. Employing the time tested robust MPU6000 gyro, V2 like its predecessor continue to be an extremely reliable flight controller board. HGLRC Flame Version 2 comes with rubber grommets further improving performance without the need for additional soft mounting hardware.

 Click here for wiring diagram

Specifications : 
Type F4 with 5V BEC
CPU STM32F405RGT6, dual 8K
Current Sensor Integrated
Firmware Target BF Omnibus F4
OSD Betaflight
On-Board Flash 16M
RX Support SBus/PPM/DSMX and other popular protocol
UART Breakout UART3, UART 6, UART 1 (SBus Serial RX1)
Other connection breakout Cam, VTx, LED, Buzzer, PPM, DSMX, RSSI, Motor 6, 3.3V and 5V
PDB  3ozs x 6 layers copper foil, total 18ozs
Input voltage 2-6S
Max current 300A
BEC Output 5V @ 3A
Size 36 x 36 mm, mounting holes M3 30.5mm
Weight  11.9g

1 pc × HGLRC F4 Flame V2 Flight Control Board

4 pcs × 1000 µF 35V capacitor

4 pcs × soft mounting rubber grommets

4 pcs × nylon standoffs

Click here for wiring diagram.

TR Tip: If your FC does not comes with a vibration isolated gyro, consider soft mounting to maximise the performance of your FC;  use O-rings to sandwich the FC at each of the 4 mounting holes or use rubber bobbins standoffs, especially when running fast cycle timings.

A low ESR capacitor of sufficient rating (eg 1000uf/35Volts for 4S), across the FC battery pads is helpful against electrical noise that may compromise FPV feed.To avoid grounding issues, do not use metal standoffs for FC.

Hot glue small gauge wires, such as ESC signal wires and FPV components connections at the solder joints for strain relief, this reduces instances of broken connections due to constant vibration or movement of the wires. The hot glue should cover a bit of the wire insulation near the solder joint and the solder joint itself.